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| Industry Press |
September 2, 2020
Rogers Introduces RO4450T Glass Reinforced Thermoset BondplyRO4450T Bondply: Now available in additional multiple thickness options Chandler, AZ: Wireless circuit designers can now enjoy a true breakthrough with Rogers Corporation's (NYSE: ROG) RO4450T™ bondply. This product offers designers a spread glass reinforced bonding material in seven thickness options ranging between 0.0025" (0.064mm) and 0.006" (0.152mm), greatly improving flexibility for high multilayer board count designs. RO4450T glass reinforced thermoset bondplies were developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 materials. The thermosetting hydrocarbon ceramic resin system facilitates a high post cure Tg, making these materials an excellent choice for multilayers requiring sequential laminations as fully cured RO4400 bondplys are capable of handling multiple lamination cycles. In addition, FR-4 compatible bond requirements permit RO4450T bondply and low flow FR-4 bondply to be combined into non-homogeneous multilayer constructions using a single bond cycle. RO4450T bondplys are recognized by Underwriter Laboratories with the UL 94 V-0 flame rating, and are compatible with lead-free processes. Rogers Corporation More Information September 14, 2023 Rogers Corp. to Highlight Materials for Millimeter Wave Designs at PCB West Rogers Corporation will exhibit at PCB West in Santa Clara, CA (booth #201) highlighting some of its high performance circuit materials used in multilayer structures ... April 25, 2023 Rogers Corp. to Exhibit at Del Mar Electronics & Manufacturing Show Rogers Corporation will exhibit at the Del Mar Electronics & Manufacturing Show April 26th & 27th at the Del Mar Fairgrounds in San Diego, CA (booth #622). High performance ... January 31, 2023 Rogers Corporation Exhibiting at DesignCon 2023 Rogers Corporation will exhibit at DesignCon in Santa Clara, CA (booth #614) highlighting some of its high performance circuit materials. DesignCon is a premiere ... January 24, 2023 Rogers Corp. and Fortify Joint Agreement to Promote 3D Printing Technology Rogers Corporation and 3D Fortify Inc. entered into an expanded agreement to jointly promote Fortify’s 3D printing equipment and Rogers' 3D printable ... January 20, 2023 Rogers Corp. to Highlight Next Generation Innovative Materials at IPC APEX Rogers Corporation (NYSE: ROG) will be exhibiting in booth #409 at IPC APEX EXPO in San Diego, CA Jan. 24th - 26th, highlighting some of its next generation ... September 21, 2022 Rogers Corp Highlights Advanced Materials at Defense TechConnect Summit Rogers Corporation will exhibit its advanced material solutions for Aerospace & Defense markets at the Defense TechConnect Summit & Expo 2022, Booth # 513, at the ... June 15, 2022 Rogers Corporation to Exhibit & Present Technical Topics at 2022 IMS Rogers Corporation has announced that Technical Marketing Manager, John Coonrod, will give 3 presentations on June 21st in the MicroApps Theater at the International ... June 2, 2022 Rogers Expands RO3003G2 Laminates with Thinner Copper Foil Option Rogers Corporation expanded the copper foil options available with RO3003G2™ laminates to include thinner, 9 micron electrodeposited HVLP foil. Expanded copper foil ... April 26, 2022 Rogers Corporation to Present High Performance Circuit Materials at Del Mar Rogers Corporation will exhibit at the Del Mar Electronics & Manufacturing Show May 4th and 5th at the Del Mar Fairgrounds in San Diego, CA (booth #622). High performance ... April 5, 2022 Rogers Corp. to Exhibit at DesignCon 2022 Rogers Corporation will exhibit at DesignCon in Santa Clara, CA (booth #518) highlighting some of its high performance circuit materials used in multilayer structures ... |
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