Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Underfilling Using Continuous Path Motion Control

New device configurations change the amount of fluid needed for underfill and the dispensing techniques for depositing it. Using a continuous motion of the dispense head avoids backtracking and improves units per hour by 27%. Download now.

Nordson Electronics Solution (previously Nordson ASYMTEK)

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura