Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

How To Relieve Thermally Induced Stress With Epoxies

Many of today's intricate electronic assemblies are highly
sensitive to the effects of temperature excursions, shock and vibration. An
effective design strategy for managing thermal stress is to use stress
absorbing materials to bond and encapsulate components. Design engineers can
learn more about finding ways to minimize or relieve stress in this white
paper.

Master Bond Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura