Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Dispensing Thermal Interface Materials

Challenges of automated dispensing of thermal
interface materials (TIM) are based on material composition, target dispense
amount, and process repeatability. However, accurately dispensing TIM is
possible using tools that can handle multiple package sizes and provide a range
of shot capability.

Precision Valve & Automation PVA

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura