Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

X-ray Inspection in Counterfeit Electronic Component Detection

X-ray inspection has become a part of counterfeit component detection and covered in SAE Standard AS6081. The standard highlights the importance of low levels of radiation to prevent damage and real-time x-ray compliance of MIL Std 883.

Glenbrook Technologies Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura