Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Importance of Source / Second Source Qualification

Regardless of how well documented and
controlled your manufacturing process may be or how many control charts are
generated and updated, your manufacturing process will never reach its full
potential or be 'in control,' unless the source(s) of incoming materials that
feed your business (manufacturing line) is uniform, consistent and repeatable.

Techcon

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura