Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Rapid and Effective X-ray Inspection of Ball Grid Arrays

The use of X-ray inspection for quality control of ball grid array (BGA) bonding has become widespread in surface mount assembly. The number of equipment suppliers and features have proliferated, but the understanding of what the BGA X-ray image means has not advanced very far beyond the simple and obvious defects of shorts, missing balls; and the misplaced concerns over small solder voids.

Glenbrook Technologies Inc.

Complete the form below to download this technical paper.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura