| Industry Paper |
Rapid and Effective X-ray Inspection of Ball Grid Arrays
The use of X-ray inspection for quality control of ball grid array (BGA) bonding has become widespread in surface mount assembly. The number of equipment suppliers and features have proliferated, but the understanding of what the BGA X-ray image means has not advanced very far beyond the simple and obvious defects of shorts, missing balls; and the misplaced concerns over small solder voids.
Glenbrook Technologies Inc.
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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