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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Combating Oxidation and Inter-metallics in Moisture Sensitive Components
Higher oxidation tendencies of lead free alloys means traditional handling and baking methods create more problems than ever. Even one exposure to baking induces oxidation and inter-metallic growth and reduces the wetting ability of interconnect surfaces. Prevention and alternative drying methods are detailed.
SuperDry Totech
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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