circuitnet
Sponsor
Air-Vac Engineering
High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering
Industry Paper

Combating Oxidation and Inter-metallics in Moisture Sensitive Components

Higher oxidation tendencies of lead free alloys means traditional handling and baking methods create more problems than ever. Even one exposure to baking induces oxidation and inter-metallic growth and reduces the wetting ability of interconnect surfaces. Prevention and alternative drying methods are detailed.
SuperDry Totech
Complete the form below to download this technical paper.

Your Name


Your Company
Your E-mail


Your Country
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Glenbrook Technologies
Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies