| Industry Paper |
Combating Oxidation and Inter-metallics in Moisture Sensitive Components
Higher oxidation tendencies of lead free alloys means traditional handling and baking methods create more problems than ever. Even one exposure to baking induces oxidation and inter-metallic growth and reduces the wetting ability of interconnect surfaces. Prevention and alternative drying methods are detailed.
SuperDry Totech
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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