Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Improved Performance with Simultaneous 2D + 3D Inspection

When improving optical inspection performance,
it is necessary to understand both advantages and shortcomings of used
technologies. By combining 2D and 3D inspection, it is possible to extend
coverage beyond commonly inspected components, while maintaining proven
reliable performance.

Test Research, Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura