Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Falling short on cleaning with water only?

Industry
developments have demonstrated that pure DI-water processes may no longer
produce cleanliness levels required for long term reliability of
assemblies. This study assesses the cleaning performance of a newly
developed cleaning technology used at low concentrations and wash temperatures.

ZESTRON Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura