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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Falling short on cleaning with water only?

Industry
developments have demonstrated that pure DI-water processes may no longer
produce cleanliness levels required for long term reliability of
assemblies. This study assesses the cleaning performance of a newly
developed cleaning technology used at low concentrations and wash temperatures.
ZESTRON Corporation
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Sponsor
Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp