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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
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Ormet TLPS
Industry Paper

End-of-process AOI Catches Mixed Technology Process Problems

Mixed-technology Assemblies create a number of
additional processing problems not found in either conventional SMT or THT
production. An AOI system that simultaneously inspects both the top and bottom
sides of mixed technology PCBs, catching end-of-process problems, is described.
ASC International
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH