Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

End-of-process AOI Catches Mixed Technology Process Problems

Mixed-technology Assemblies create a number of
additional processing problems not found in either conventional SMT or THT
production. An AOI system that simultaneously inspects both the top and bottom
sides of mixed technology PCBs, catching end-of-process problems, is described.

ASC International

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura