Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

How to Minimize Defects by Adjusting the Reflow Profile

A properly designed and adjusted reflow profile
is one of the most important factors to achieve defect-free, high quality
solder joints during a surface mount reflow process. Many defects can be
minimized or eliminated by optimizing the reflow profile.

Metallic Resources, Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura