Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Is Cleaning Critical to PoP Assemblies?

Package on package assemblies are widely
growing in use for applications that require small footprint technology. This study evaluates the cleanliness levels
underneath PoP components and in between packages. Results empirically confirm the effectiveness
of cleaning for this rapidly evolving technology.

ZESTRON Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura