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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Advances in Aerosol Benchtop Cleaning Maximise Environmental Protections
Two decades of environmental progress has profoundly changed benchtop cleaning in electronics. This paper will highlight the problems caused by inconsistent regulations, and recommend a three-step process engineers can use when searching for continuing improvements.
MicroCare, LLC
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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