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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Understanding the Role of Auto ID in the FDA's UDI Initiative
The U.S. FDA's proposed UDI (Unique Device Identification) program contains much that is of interest to the Auto ID community and to manufacturers and labelers of medical devices. Describes the UDI program, which devices are affected, and implementation of the requirements.
Microscan Systems Inc.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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