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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Understanding the Role of Auto ID in the FDA's UDI Initiative

The U.S. FDA's proposed UDI (Unique Device Identification) program contains much that is of interest to the Auto ID community and to manufacturers and labelers of medical devices. Describes the UDI program, which devices are affected, and implementation of the requirements.
Microscan Systems Inc.
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Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH