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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

The 'Endless Piston' Pump Technology for Precision Dispensing

An ideal process involving the application of fluids and liquids like
adhesives, oil, ink, paint, grease, solder paste, enzymes or catalysts
would be to have a pre‐determined volume of material applied to a
location with accuracy and consistency ...
Intertronics
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH