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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Industry Paper

Bandwidth Tests Reveal Shrinking Eye Diagrams and Signal Integrity Problems

Factors like jitter, inter-symbol interference
(ISI), crosstalk and others can create havoc on the signal integrity of
high-speed serdes and memory channels, making maximum bus speeds difficult to
achieve in practice. Compounding this predicament is the fact that channel
speeds keep increasing from one generation bus technology to the next ...
ASSET InterTech, Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura