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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Printing and Assembly Challenges for Quad Flat No-Lead (QFN) Packages
QFN devices present challenges to the assembly process, but with proper stencil design, proper stencil technology and proper PCB solder mask layout these can be overcome. QFN repair accomplished by printing solder paste directly onto the QFN leads and ground plane.
Photo Stencil, LLC
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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