Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

The Problem with UL Approval of Rigid Flex Circuits

Greater
acceptance of rigid flex circuit boards in medical and other high reliability
electronic packaging has created a demand for UL recognition. Supplier UL
recognition eliminates the cost and time required for electronics designers and
buyers to qualify their rigid flex boards.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura