Sponsor

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS

Industry Paper

The Problem with UL Approval of Rigid Flex Circuits

Greater
acceptance of rigid flex circuit boards in medical and other high reliability
electronic packaging has created a demand for UL recognition. Supplier UL
recognition eliminates the cost and time required for electronics designers and
buyers to qualify their rigid flex boards.

Complete the form below to download this technical paper.

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Sponsor

Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH