Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Process Improvements in Fluid Dispensing

Jetting technology provides a discrete volume of material with each jet shot, greatly increasing dispensing speed because z-axis movement isn't needed to overcome fluid cohesion. Jetting is done on-the-fly with fluid deposited in tight places and the ability to use a wide range of fluids.

Nordson Electronics Solution (previously Nordson ASYMTEK)

Complete the form below to download this technical paper.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura