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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Process Improvements in Fluid Dispensing

Jetting technology provides a discrete volume of material with each jet shot, greatly increasing dispensing speed because z-axis movement isn't needed to overcome fluid cohesion. Jetting is done on-the-fly with fluid deposited in tight places and the ability to use a wide range of fluids.
Nordson Electronics Solutions
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Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH