Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Data Preparation, Load Balancing, and Schedule Performance

The rate of on-time delivery coupled with
measurement of actual unit cost, compared to planned unit cost are critical Key
Performance Indicators for success and profitability. This paper addresses
several critical factors in achieving on-time delivery and unit cost targets.

Mentor Graphics Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura