Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Cost Effective 3D Glass Microfabrication for Advanced Packaging Applications

3D Glass Solutions has developed photo-structurable APEX Glass which enables complex features such as anisotropic through glass vias (TGVs), trenches, and wells, among other features, to easily be processed using a simple three step manufacturing process.

3D Glass Solutions

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura