Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Re-tinning Components for Hi-Rel Assembly

There are essentially five reasons for
re-tinning components, including conversion of Sn/Pb components to RoHS (and
the reverse), Refurbishing of "Legacy Components", Tin Whisker Mitigation, and
Gold Embrittlement Mitigation. This paper describes the reasons and methodology
for all.

Nordson SELECT

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura