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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Basics of ESD Safety and Data Tracking
This white paper presents an overview of the basics of ESD and its impact on electronics manufacturing -- specifically, as it necessitates protocols for maintaining safety and product quality. ESD damage to electronic components can greatly reduce production efficiency and drive up costs. It is important for all personnel working in electronics manufacturing environments to follow ESD safety protocols to eliminate these risks.
Microscan Systems Inc.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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