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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Industry Paper

Technical Considerations for Controlling ESD in Electronics Manufacturing

As device geometries get smaller and processing
speeds grow faster, their ESD sensitivity increases. Designers face the
challenge of fitting more active component features into smaller chip
territory, often at the expense of on-chip protection devices. The trade off is
greater risk for ESD damage. This white paper gives an overview of ESD, the
associated risks and recommended measures for ESD prevention.
Microscan Systems Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura