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Industry Paper

Technical Considerations for Controlling ESD in Electronics Manufacturing

As device geometries get smaller and processing
speeds grow faster, their ESD sensitivity increases. Designers face the
challenge of fitting more active component features into smaller chip
territory, often at the expense of on-chip protection devices. The trade off is
greater risk for ESD damage. This white paper gives an overview of ESD, the
associated risks and recommended measures for ESD prevention.
Microscan Systems Inc.
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH