Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

There's Life in the Old Dog yet -- Quality Control of PCBs with THT Placement

Learn how utilisation of AOI systems for THT
component and solder joint inspection makes sense in a flexible production and
test strategy for manufacturing small and medium-sized batches of PCBs with
mixed components.

GOEPEL Electronic

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura