Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Virtual Access Techniques Augments Test Coverage on Limited Access PCB Assemblies

Due to changes in manufacturing requirements, there are
challenges in testing PCBs with limited test access. This paper describes a
powered opens test technique that allows for virtual access on higher-density
PCB assemblies where there is limited test pad access.

Teradyne Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura