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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Time Savings in Placement through Family Setups

High mix assembly requires frequent change-over, which interrupts production and results in lower equipment uptime and utilization. The solution is highly flexible equipment driven by powerful software solutions. Reducing changeover requirements is key to increasing line uptime and greater profitability.
Hitachi High Technologies America, Inc.
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Sponsor
Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp