Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Time Savings in Placement through Family Setups

High mix assembly requires frequent change-over, which interrupts production and results in lower equipment uptime and utilization. The solution is highly flexible equipment driven by powerful software solutions. Reducing changeover requirements is key to increasing line uptime and greater profitability.

Hitachi High Technologies America, Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura