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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Advantages of Multiple Resolutions in Automated 3D X-Ray Inspection
Review the benefits of multiple resolution inspection capabilities in Automated 3D X-ray Inspection. With several Automated X-Ray Inspection suppliers available it's important for the company purchasing an AXI System to understand the features and limitations of the different solutions available.
Test Research, Inc.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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