Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Solder Paste Residue Corrosiveness Assessment: Bono Test

Lead-free solder & No-clean solder pastes are the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes IPC J-STD-004 corrosion and other tests. The Bono test has been developed and implemented as another qualification criterion.

Inventec Performance Chemicals

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura