| Industry Paper |
Solder Paste Residue Corrosiveness Assessment: Bono Test
Lead-free solder & No-clean solder pastes are the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes IPC J-STD-004 corrosion and other tests. The Bono test has been developed and implemented as another qualification criterion.
Inventec Performance Chemicals
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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