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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Metallurgy of the Soldering Process

Soldering is a specific science that encompasses a number of disciplines and demand considerable expertise to master. The process of soldering is about the interaction of materials at a molecular, or even atomic, level. Learn more with this technical article.

Rehm Thermal Systems GmbH

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura