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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Why Program Devices at In-Circuit Test?
Manufacturers have flexibility deciding how to program firmware and application data into their on-board Programmable Logic Device (PLD) and FLASH Memory components. This paper describes various In-System-Programming (ISP) manufacturing options and why programming during the in-circuit stage is one of the most economical and efficient manufacturing
choices.
Teradyne Inc.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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