Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

An Electrically Conductive Adhesive with Bottom Line Benefits

A new breakthrough electrically conductive adhesive (ECA) offers compatibility with non-noble metallizations, allowing manufacturers to incorporate lower-cost, tin-terminated components. Because the new ECA can be used with tin-terminated components and lower-cost, organic-coated PWBs, significant savings can be realized.

Henkel Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura