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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Managing Moisture Damage in PCBs
Guidelines for the proper stocking and moisture protection of electronic components can be found in IPC standards. Because there were no published standards for storage and moisture protection for PCBs until 2010, they were generally overlooked. But with the correct stocking control and the use of professional drying methods ...
SuperDry Totech
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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