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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Industry Paper

Responsible Manufacturing in the Electronics Industry

With environmental awareness at an all time high, companies are looking for 'greener' options within their production processes. This white paper discusses how significant improvements can be made in terms of environmental and end-user effects by reviewing products used within the electronics industry for cleaning, conformal coating, encapsulation and general maintenance, amongst others.
Electrolube
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura