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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

FPGA-Controlled Test (FCT):What it is and why is it needed?

A new method for validating, testing and debugging circuit boards embeds a board-tester-in-a-chip. FPGA-controlled test (FCT) automatically inserts multiple instruments in an FPGA and operates them as a tester that can be easily removed when it is no longer needed or it can remain in-system.
ASSET InterTech, Inc.
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH