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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
SMT Packaging Drives the Move to Multilayer Prototypes
As components move increasingly into SMT packages exclusively, prototype manufacturers are seeing changes in the fabrication and assembly work needed for engineering prototypes. As new components come to market in SMT packages, board design must change to accommodate these components.
Sunstone Circuits
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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