|
| Industry Paper |
SMT Packaging Drives the Move to Multilayer Prototypes
As components move increasingly into SMT packages exclusively, prototype manufacturers are seeing changes in the fabrication and assembly work needed for engineering prototypes. As new components come to market in SMT packages, board design must change to accommodate these components.
Sunstone Circuits
|
|
Complete the form below to download this technical paper.
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
