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| Industry Paper |
Testing and Prevention of Head-in-Pillow
Head-in-pillow (HIP) is ailing the electronic industry when assembling BGAs or CSPs onto PCBs. It is caused by warpage of components or boards at reflow process, and is aggravated by oxidation. Methods for assessing the potential for occurrence of HIP are highly desired by the industry. Find out more...
Indium Corporation
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