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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Testing and Prevention of Head-in-Pillow
Head-in-pillow (HIP) is ailing the electronic industry when assembling BGAs or CSPs onto PCBs. It is caused by warpage of components or boards at reflow process, and is aggravated by oxidation. Methods for assessing the potential for occurrence of HIP are highly desired by the industry. Find out more...
Indium Corporation
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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