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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Cleaning Technologies - Trends and Developments
Cleaning is an essential process within electronics manufacture and has been used for many years to remove potentially harmful contaminants during PCB manufacture. Such contaminants include flux, solder and adhesive residues, and other more general contaminants such as dust and debris present from other manufacturing processes. Read more...
Electrolube
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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