| Industry Paper |
Flip Chip Soldering onto an IC Substrate
An increase in implementation of Flip Chips, Dies, and other micro SMD devices with hidden joints within PCB and IC assembly sectors requires capability to precisely install and rework such devices. This paper details a process for a Flip Chip being mounted to a BGA IC substrate.
Advanced Techniques US Inc.
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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