|
Sponsor
|
|
Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC
|
|
| Industry Paper |
Flip Chip Soldering onto an IC Substrate
An increase in implementation of Flip Chips, Dies, and other micro SMD devices with hidden joints within PCB and IC assembly sectors requires capability to precisely install and rework such devices. This paper details a process for a Flip Chip being mounted to a BGA IC substrate.
Advanced Techniques US Inc.
|
Complete the form below to download this technical paper.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
Optimize Your Process on Full SMT Demo Line
Validate your process in our demo lab. Our full line—printing, P&P, reflow, and AOI—is ready to optimize your profile and prove performance. Send us your boards to start.
Heller Industries
|
|
|