Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Flip Chip Soldering onto an IC Substrate

An increase in implementation of Flip Chips, Dies, and other micro SMD devices with hidden joints within PCB and IC assembly sectors requires capability to precisely install and rework such devices. This paper details a process for a Flip Chip being mounted to a BGA IC substrate.

Advanced Techniques US Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura