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| Industry Paper |
Automating Thermal Stress Reflow Simulation on PCBs
Paper demonstrates the reflow process of thermal stress reflow simulation on bare PCB's per IPC-TM-650 Test Method 2.6.27. This standard requires PCBs or test coupons to be reflowed six times and then evaluated for quality compliance. By automating the cycles within a reflow oven, consistency is attainable and efficiency greatly improved.
Advanced Techniques US Inc.
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