Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Automating Thermal Stress Reflow Simulation on PCBs

Paper demonstrates the reflow process of thermal stress reflow simulation on bare PCB's per IPC-TM-650 Test Method 2.6.27. This standard requires PCBs or test coupons to be reflowed six times and then evaluated for quality compliance. By automating the cycles within a reflow oven, consistency is attainable and efficiency greatly improved.

Advanced Techniques US Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura