| Industry Paper |
Automating Thermal Stress Reflow Simulation on PCBs
Paper demonstrates the reflow process of thermal stress reflow simulation on bare PCB's per IPC-TM-650 Test Method 2.6.27. This standard requires PCBs or test coupons to be reflowed six times and then evaluated for quality compliance. By automating the cycles within a reflow oven, consistency is attainable and efficiency greatly improved.
Advanced Techniques US Inc.
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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