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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
UV Curing Adhesives Shine
UV curable adhesives are among the most user friendly adhesive products on the market today if you know how to apply them. Master Bond's new white paper takes a closer look at the capabilities of UV curable formulations, the requirements for an optimal cure and the best applications for these versatile 100% reactive adhesives.
Master Bond Inc.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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