Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

IEEE P1687 Internal JTAG (IJTAG) taps into Embedded Instrumentation

Al Couch, ASSET's chief technologist and co-chairman of the IEEE P1687 IJTAG working group, explains how the standard will enable instruments originally embedded into chips for chip characterization and test can be re-used later in circuit board design validation, volume manufacturing test and field service troubleshooting. The IEEE P1687 preliminary standard is expected to be ratified by early 2012.

ASSET InterTech, Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura