Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Machine and Process Capability in Reflow Soldering

Process capability and machine capability describe the potential capability of a process (machine) to produce a certain characteristic in a constant fashion within specified tolerance limits. This paper will identify parameters to maintain a high performance reflow soldering process.

Rehm Thermal Systems GmbH

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura