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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
New Optimized Drying Process for Moisture Sensitive Devices
New closed loop desiccant drying units dynamically adjust the essential desiccant regeneration process according to actual demand. Compared to cyclical methods, this saves significant energy and increases system availability and performance...
SuperDry Totech
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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