Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Stencil Manufacturing Methods and Their Impact On Precision & Accuracy

Stencil positional accuracy, a function of the manufacturing process, is influenced by various parameters, such as different laser systems, various metals and processes, temperature variations and stencil frames. The total effect will be measured according to today's practices using available laser systems and processes.

LPKF Laser & Electronics

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura