Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Process Validation 101

When working with an EMS company, it is important they employ process validation procedures to avoid product failures and the time, expense and serious consequences of failures in the field. Select a contract manufacturer as a manufacturing partner, and ensure that they are ISO 13485:2003-certified.

Digicom Electronics

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura