Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Micron Level Placement Accuracy Case Studies for Optoelectronic Products

Applications requiring ultra-high placement accuracies of 1-3 1/4m are resurfacing in several optoelectronic applications such as Arrayed Laser Print Head assemblies, P-Side Down Laser Attachment applications, and Multi- Channel Optical Communication products. This whitepaper presents the technologies, placement accuracies and attachment methods in two cases.

Palomar Technologies, Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura