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Sponsor
Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Micron Level Placement Accuracy Case Studies for Optoelectronic Products

Applications requiring ultra-high placement accuracies of 1-3 1/4m are resurfacing in several optoelectronic applications such as Arrayed Laser Print Head assemblies, P-Side Down Laser Attachment applications, and Multi- Channel Optical Communication products. This whitepaper presents the technologies, placement accuracies and attachment methods in two cases.
Palomar Technologies, Inc.
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH