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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Understanding NAND Flash Factory Programming
NAND Flash represents the lowest cost-per-bit memory for embedded electronic designs, but not without penalties. In this white paper, you will learn how to navigate this downside early in your design phase and keep the cost advantages through manufacturing cycle.
BPM Microsystems
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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