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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Reworking BGA Components Reliably
The industry has seen an increase in the need to reball valuable BGA components for re-use. While there are various ways to performing reballing, a simple, stand-alone reball unit provides consistent and repeatable temperature control for the most demanding BGAs & CSPs.
Finetech
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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