| Industry Paper |
Reworking BGA Components Reliably
The industry has seen an increase in the need to reball valuable BGA components for re-use. While there are various ways to performing reballing, a simple, stand-alone reball unit provides consistent and repeatable temperature control for the most demanding BGAs & CSPs.
Finetech
|
Complete the form below to download this technical paper.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
|
|
|
